AIM’s solder preforms provide a precise volume of solder for each solder joint that is uniform over high volumes.  This provides high volume solder assembly operations with increased yield via precise delivery & control of solder to each interconnect.

AIM manufactures solder preforms in a wide range of alloys/melt points ranging from 60°C to 356°C. These alloys include gold-tin/gold-germanium, pure indium and indium alloys, RoHS compliant Lead-free alloys, and standard tin-lead compositions. Preforms can be manufactured to customer specification in any size or shape including rectangles, washers, discs, and frames. We also stamp complex parts to customer specifications; length/width/diameter:  0.010” and greater, thickness: 0.001” and greater. We offer AIM fluxes and cleaners for use with our solder preforms. Available flux chemistries include RA, RMA, No Clean and Water Soluble. Fluxes can be supplied in liquid or paste forms and can be pre-coated onto the solder preforms.

● Die attach of semiconductor, LED, and laser chips
● PCB’s: Increase solder volume/fillets on PCB through-holes
● Package/lid sealing
● Thermal interface: Chip-to-lid / lid-to-heat sink 
▪ Wide Range of Alloy Compositions Available
▪ Melting Points Ranging From 10.7°C up to 356°C